Lead-free Solder

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2001-05-15
Authors
Anderson, Iver
Terpstra, Robert
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Iowa State University Research Foundation, Inc.
The Iowa State University Research Foundation (ISURF) seeks to protect the intellectual property (including new discoveries, technologies, or creative works) of the university's students & faculty which is continuously created through research and other undertakings. It seeks to manage, protect, and own all intellectual property on behalf of the university. The Iowa State University Research Foundation was created in 1938.
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Abstract

A Sn—Ag—Cu eutectic alloy is modified with one or more low level and low cost alloy additions to enhance high temperature microstructural stability and thermal-mechanical fatigue strength without decreasing solderability. Purposeful fourth or fifth element additions in the collective amount not exceeding about 1 weight % (wt. %) are added to Sn—Ag—Cu eutectic solder alloy based on the ternary eutectic Sn—4.7%Ag—1.7%Cu (wt. %) and are selected from the group consisting essentially of Ni, Fe, and like-acting elements as modifiers of the intermetallic interface between the solder and substrate to improve high temperature solder joint microstructural stability and solder joint thermal-mechanical fatigue strength.

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