Lead-free Solder

dc.contributor.author Anderson, Iver
dc.contributor.author Terpstra, Robert
dc.contributor.department Iowa State University Research Foundation, Inc.
dc.date 2018-02-13T14:00:34.000
dc.date.accessioned 2020-06-30T06:16:23Z
dc.date.available 2020-06-30T06:16:23Z
dc.date.embargo 2013-09-05
dc.date.issued 2001-05-15
dc.description.abstract <p>A Sn—Ag—Cu eutectic alloy is modified with one or more low level and low cost alloy additions to enhance high temperature microstructural stability and thermal-mechanical fatigue strength without decreasing solderability. Purposeful fourth or fifth element additions in the collective amount not exceeding about 1 weight % (wt. %) are added to Sn—Ag—Cu eutectic solder alloy based on the ternary eutectic Sn—4.7%Ag—1.7%Cu (wt. %) and are selected from the group consisting essentially of Ni, Fe, and like-acting elements as modifiers of the intermetallic interface between the solder and substrate to improve high temperature solder joint microstructural stability and solder joint thermal-mechanical fatigue strength.</p>
dc.format.mimetype application/pdf
dc.identifier archive/lib.dr.iastate.edu/patents/81/
dc.identifier.articleid 1079
dc.identifier.contextkey 4556492
dc.identifier.s3bucket isulib-bepress-aws-west
dc.identifier.submissionpath patents/81
dc.identifier.uri https://dr.lib.iastate.edu/handle/20.500.12876/56767
dc.language.iso en
dc.source.bitstream archive/lib.dr.iastate.edu/patents/81/US6231691.pdf|||Sat Jan 15 02:06:03 UTC 2022
dc.subject.disciplines Materials Science and Engineering
dc.subject.keywords Ames Laboratory
dc.subject.keywords Materials Science and Engineering
dc.title Lead-free Solder
dc.type article
dc.type.genre patent
dspace.entity.type Publication
relation.isOrgUnitOfPublication 0b21e0ba-edf0-4137-9d16-53da01b11c6e
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