Simulation of chemical mechanical planarization of copper with molecular dynamics

dc.contributor.author Ye, Y.
dc.contributor.author Biswas, Rana
dc.contributor.author Bastawros, Ashraf
dc.contributor.author Chandra, Abhijit
dc.contributor.author Bastawros, Ashraf
dc.contributor.department Aerospace Engineering
dc.contributor.department Ames Laboratory
dc.contributor.department Physics and Astronomy
dc.contributor.department Mechanical Engineering
dc.date 2018-02-17T14:57:05.000
dc.date.accessioned 2020-06-29T22:46:10Z
dc.date.available 2020-06-29T22:46:10Z
dc.date.copyright Tue Jan 01 00:00:00 UTC 2002
dc.date.issued 2002-09-01
dc.description.abstract <p>With an aim to understanding the fundamental mechanisms underlying chemical mechanical planarization ~CMP! of copper, we simulate the nanoscale polishing of a copper surface with molecular dynamics utilizing the embedded atom method. Mechanical abrasion produces rough planarized surfaces with a large chip in front of the abrasive particle, and dislocations in the bulk of the crystal. The addition of chemical dissolution leads to very smooth planarized copper surfaces and considerably smaller frictional forces that prevent the formation of bulk dislocations. This is a first step towards understanding the interplay between mechanistic material abrasion and chemical dissolution in chemical mechanical planarization of copper interconnects.</p>
dc.description.comments <p>The following article appeared in <em>Applied Physics Letters</em> 81, 10 (2002): 1875 and may be found at doi:<a href="http://dx.doi.org/10.1063/1.1505113" target="_blank"> 10.1063/1.1505113</a>.</p>
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dc.identifier archive/lib.dr.iastate.edu/aere_pubs/68/
dc.identifier.articleid 1067
dc.identifier.contextkey 8366749
dc.identifier.s3bucket isulib-bepress-aws-west
dc.identifier.submissionpath aere_pubs/68
dc.identifier.uri https://dr.lib.iastate.edu/handle/20.500.12876/2070
dc.language.iso en
dc.source.bitstream archive/lib.dr.iastate.edu/aere_pubs/68/2002_BastawrpsAF_SimulationChemicalMechanical.pdf|||Sat Jan 15 01:28:43 UTC 2022
dc.source.uri 10.1063/1.1505113
dc.subject.disciplines Aerospace Engineering
dc.subject.disciplines Engineering Physics
dc.subject.disciplines Mechanical Engineering
dc.title Simulation of chemical mechanical planarization of copper with molecular dynamics
dc.type article
dc.type.genre article
dspace.entity.type Publication
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