Ultrasonic NDE of Adhesive Metal to Metal Bond Integrity Based on a Combined Numerical and Expert System Approach

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1993
Authors
Ludwig, Reinhold
Sullivan, John
Dai, Dacheng
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Altmetrics
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Abstract

Bonded structures have become increasingly prevalent in the safe and reliable operation of many advanced material components. Concomitant with the wide-spread use of adhesively bonded materials comes the need of nondestructive inspection of the bond line. Since conventional NDE methods offer only partial success in detecting the various possible bondline conditions [1], additional research in the actual energy/bondline interaction is required.

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