The Ultrasonic Detection of Environmental Degradation in Adhesive Joints

dc.contributor.author Vine, K.
dc.contributor.author Cawley, P.
dc.contributor.author Kinloch, A.
dc.date 2018-02-14T08:26:12.000
dc.date.accessioned 2020-06-30T06:48:57Z
dc.date.available 2020-06-30T06:48:57Z
dc.date.copyright Thu Jan 01 00:00:00 UTC 1998
dc.date.issued 1998
dc.description.abstract <p>There are many benefits to be gained when using adhesives compared with the use of more traditional joining techniques. Amongst these advantages can be listed the ability to join dissimilar materials, the uniform distribution of load over the area of the joint avoiding stress concentrations, the improvement in aesthetics and, potentially, a lower-weight for the component or structure. However several factors have retarded the more widespread use of adhesives. These principally are (i) the detrimental effect of moisture on the joint strength and (ii) the lack of a suitable non-destructive testing technique for detecting strength loss due to environmental attack. It is the latter problem that the present work addresses. The focus of this work has been to examine the bonding of aluminium alloy to aluminium alloy, using an epoxy-based adhesive.</p>
dc.format.mimetype application/pdf
dc.identifier archive/lib.dr.iastate.edu/qnde/1998/allcontent/173/
dc.identifier.articleid 3765
dc.identifier.contextkey 5810851
dc.identifier.s3bucket isulib-bepress-aws-west
dc.identifier.submissionpath qnde/1998/allcontent/173
dc.identifier.uri https://dr.lib.iastate.edu/handle/20.500.12876/61332
dc.language.iso en
dc.source.bitstream archive/lib.dr.iastate.edu/qnde/1998/allcontent/173/1998_Vine_UltrasonicDetection.pdf|||Fri Jan 14 21:19:59 UTC 2022
dc.source.uri 10.1007/978-1-4615-5339-7_173
dc.title The Ultrasonic Detection of Environmental Degradation in Adhesive Joints
dc.type event
dc.type.genre article
dspace.entity.type Publication
File
Original bundle
Now showing 1 - 1 of 1
Name:
1998_Vine_UltrasonicDetection.pdf
Size:
1.08 MB
Format:
Adobe Portable Document Format
Description: