Liquid-phase diffusion bonding and the development of a Cu-Ni/Sn composite solder paste for high temperature lead-free electrical connections

dc.contributor.advisor Iver E. Anderson
dc.contributor.author Choquette, Stephanie
dc.contributor.department Department of Materials Science and Engineering
dc.date 2018-09-13T03:00:54.000
dc.date.accessioned 2020-06-30T03:11:57Z
dc.date.available 2020-06-30T03:11:57Z
dc.date.copyright Tue May 01 00:00:00 UTC 2018
dc.date.embargo 2001-01-01
dc.date.issued 2018-01-01
dc.description.abstract <p>After gathering sufficient microstructural evidence that a practical high-temperature lead-free solder could be produced through liquid-phase diffusion bonding (LPDB) of gas-atomized Cu-Ni powder blended with SN100C (Sn-0.7Cu-0.05Ni, wt.%) commercial solder powder, additional research was completed to enable design of a prototype composite solder paste. By reviewing several experimental alternatives to LPDB for use as replacements and improvements to the currently-used high-Pb solders (which will inevitably be banned by the EU’s RoHS directive), the choice to pursue the prototype solder paste research was verified. One key difference between this research and that of others is the method of pre-alloying Cu with Ni before atomization of the metal powder particles. These Ni additions prevent a detrimental unit cell volume change from occurring in typical Sn-Cu solder alloys by suppressing the hexagonal-to-monoclinic isothermal phase transformation upon cooling during reflow to below 186à °C. Rapid diffusion of the Ni and Cu was explored in order to better design the composite paste’s suggested reflow profile. Research to study and maximize the grain boundary diffusion of Ni and its effect on the resulting intermetallic compounds helped determine the final composition of the composite paste for use in industry.</p>
dc.format.mimetype application/pdf
dc.identifier archive/lib.dr.iastate.edu/etd/16562/
dc.identifier.articleid 7569
dc.identifier.contextkey 12815688
dc.identifier.s3bucket isulib-bepress-aws-west
dc.identifier.submissionpath etd/16562
dc.identifier.uri https://dr.lib.iastate.edu/handle/20.500.12876/30745
dc.language.iso en
dc.source.bitstream archive/lib.dr.iastate.edu/etd/16562/Choquette_iastate_0097E_17129.pdf|||Fri Jan 14 21:02:14 UTC 2022
dc.subject.disciplines Materials Science and Engineering
dc.subject.disciplines Mechanics of Materials
dc.subject.keywords Composite Solder Paste
dc.subject.keywords Harsh Environment Solder
dc.subject.keywords Pb-Free Solder
dc.title Liquid-phase diffusion bonding and the development of a Cu-Ni/Sn composite solder paste for high temperature lead-free electrical connections
dc.type dissertation
dc.type.genre dissertation
dspace.entity.type Publication
relation.isOrgUnitOfPublication bf9f7e3e-25bd-44d3-b49c-ed98372dee5e
thesis.degree.discipline Materials Science and Engineering
thesis.degree.level dissertation
thesis.degree.name Doctor of Philosophy
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