Weak Bond Screening System

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1986
Authors
Chuang, S. Y.
Chang, F. H.
Bell, J.
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Review of Progress in Quantitative Nondestructive Evaluation
Center for Nondestructive Evaluation

Begun in 1973, the Review of Progress in Quantitative Nondestructive Evaluation (QNDE) is the premier international NDE meeting designed to provide an interface between research and early engineering through the presentation of current ideas and results focused on facilitating a rapid transfer to engineering development.

This site provides free, public access to papers presented at the annual QNDE conference between 1983 and 1999, and abstracts for papers presented at the conference since 2001.

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Abstract

The most commonly used nondestructive inspection (NDI) technique for adhesively bonded and composite structures is the ultrasonic C-scan technique operating in a pulse-echo or through-transmission mode. They are most effective in detecting disbonds, voids, delamination and foreign inslusions, but are ineffective for the detection of weak bonds at the adhesive points. Weak bonds are mostly caused by improper surface cleaning of substrates. There is no air space at the adhesive joints where the substrate and the adhesive are in intimate contact with each other. This results in a lack of interface for ultrasound reflection required for their detection by conventional ultrasonic NDI techniques. Other ultrasonic techniques such as ultrasonic spectroscopy and ultrasonic resonance testers also suffer from the same disadvantage.

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Wed Jan 01 00:00:00 UTC 1986