Ultrasonic Signal Processing of Adhesive Bonding Data Employing Chirp-Z Transform and Adaptive Filtering Techniques

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1992
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Nair, V.
Ludwig, R.
Sullivan, J.
Dai, D.
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Review of Progress in Quantitative Nondestructive Evaluation
Center for Nondestructive Evaluation

Begun in 1973, the Review of Progress in Quantitative Nondestructive Evaluation (QNDE) is the premier international NDE meeting designed to provide an interface between research and early engineering through the presentation of current ideas and results focused on facilitating a rapid transfer to engineering development.

This site provides free, public access to papers presented at the annual QNDE conference between 1983 and 1999, and abstracts for papers presented at the conference since 2001.

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Abstract

Adhesive bonding has found extensive application in the aircraft and defense industries where the failure of a bond in any of the critical load-bearing components, for example the rotor-blade of an helicopter, can bring about a catastrophic failure. Nondestructive evaluation of adhesively bonded structures attempt to assess the key factors of bond strength and quality. The bond strength [1] is primarily determined by the thickness of the bondline, as this greatly affects the stored energy in the bond. Three factors, if determined, provide a good measure of bond quality. They are bond thickness, contact angle of adhesive to substrate, and substrate surface-free energy.

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Wed Jan 01 00:00:00 UTC 1992