Kissing Bonds in Diffusion Bonded Parts
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Begun in 1973, the Review of Progress in Quantitative Nondestructive Evaluation (QNDE) is the premier international NDE meeting designed to provide an interface between research and early engineering through the presentation of current ideas and results focused on facilitating a rapid transfer to engineering development.
This site provides free, public access to papers presented at the annual QNDE conference between 1983 and 1999, and abstracts for papers presented at the conference since 2001.
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Abstract
The widespread application of diffusion bonding has been hindered, in part, by concerns over kissing bonds. Kissing bonds are generally considered to be conditions where a bond has little or no strength and the concern is that such conditions might escape detection. At Rohr we differentiate between an intimate contact disbond (which has no bond between the surfaces but is detectable by careful ultrasonic testing) and a kissing bond (which also has no bond between the surfaces but is not detectable using current ultrasonic technology). These definitions will be used throughout.