Investigation of corrosion minimization in integrated circuit assemblies

dc.contributor.author Davis, Gordon
dc.contributor.department Materials Science and Engineering
dc.date 2020-08-05T05:01:16.000
dc.date.accessioned 2021-02-26T08:38:50Z
dc.date.available 2021-02-26T08:38:50Z
dc.date.copyright Tue Jan 01 00:00:00 UTC 2002
dc.date.issued 2002-01-01
dc.description.abstract <p>Studies have shown that a major contributor to commercial-off-the-shelf (COTS) integrated circuits (ICs) package failures in harsh environmental conditions used for high reliability applications is the encapsulating material. In specific, the corrosion mechanism resulting from chloride ions residing within the encapsulating material, acting in conjunction with moisture and an electrical bias, to cause failures. This work serves to investigate the reduction of corrosion propagation, which leads to failures at the gold/aluminum bond pad interface on the IC. The project entailed the use various newly-formulated encapsulating compounds with reduced levels of chloride content, while maintaining consistent levels of bromides and sodium. It is the intent of this work to identify the maximum chloride ionic content allowable that results in no corrosion or very slow propagation of corrosion at the IC bond pad. While the corrosion mechanism is well understood in, this work is unique because the maximum threshold of allowable chlorides is under investigation. This study was completed to advance industry knowledge concerning the use of COTS components as direct replacements of hermetic parts used in extreme conditions.</p>
dc.format.mimetype application/pdf
dc.identifier archive/lib.dr.iastate.edu/rtd/19824/
dc.identifier.articleid 20823
dc.identifier.contextkey 18779767
dc.identifier.doi https://doi.org/10.31274/rtd-20200803-46
dc.identifier.s3bucket isulib-bepress-aws-west
dc.identifier.submissionpath rtd/19824
dc.identifier.uri https://dr.lib.iastate.edu/handle/20.500.12876/97191
dc.language.iso en
dc.source.bitstream archive/lib.dr.iastate.edu/rtd/19824/Davis_ISU_2002_D37.pdf|||Fri Jan 14 22:00:19 UTC 2022
dc.subject.keywords Materials science and engineering
dc.title Investigation of corrosion minimization in integrated circuit assemblies
dc.type article
dc.type.genre thesis
dspace.entity.type Publication
relation.isOrgUnitOfPublication bf9f7e3e-25bd-44d3-b49c-ed98372dee5e
thesis.degree.discipline Materials Science and Engineering
thesis.degree.level thesis
thesis.degree.name Master of Science
File
Original bundle
Now showing 1 - 1 of 1
Name:
Davis_ISU_2002_D37.pdf
Size:
1.64 MB
Format:
Adobe Portable Document Format
Description: