Yield improvement of chemical mechanical planarization processes

dc.contributor.advisor Frank Peters
dc.contributor.advisor Abhijit Chandra
dc.contributor.author Eamkajornsiri, Sutee
dc.contributor.department Department of Industrial and Manufacturing Systems Engineering
dc.date 2018-08-24T17:48:19.000
dc.date.accessioned 2020-06-30T08:24:20Z
dc.date.available 2020-06-30T08:24:20Z
dc.date.copyright Sat Jan 01 00:00:00 UTC 2005
dc.date.issued 2005-01-01
dc.description.abstract <p>Chemical mechanical polishing (CMP) is a planarization process that produces high quality surfaces both locally and globally. It is one of the key process steps during fabrication of very large scale integrated (VLSI) chips in integrated circuit (IC) manufacturing. High and reliable wafer yield is critical in the CMP process; it is dependent upon uniformity of material removal rate across the entire wafer.;The focus on this research is the development of control algorithm for CMP process. Wafer-scale and die-scale models are the two scales used in this study. To achieve improvement in wafer yield, three control strategies are formulated with greedy algorithm, method heuristic and non-linear programming in this wafer-scale. The simulation results show that average wafer yield from genetic algorithm is improved, compared to greedy algorithm. Moreover, average wafer yield from non-linear programming is also improved, compared to greedy algorithm.;At die-scale, a comprehensive control algorithm is developed based on the MRR equations with interface pressure as a control parameter. The interface pressure is varied spatially and/or temporally across the die. In this concept, three control strategies are developed and studied. The strategies are included spatial pressure control, spatial and temporal pressure control, and look-ahead scheduled pressure control. The simulation results of these three strategies show improvement in the upper surface uniformity; however, lookahead scheduled pressure control seems to be the promising algorithm.</p>
dc.format.mimetype application/pdf
dc.identifier archive/lib.dr.iastate.edu/rtd/3043/
dc.identifier.articleid 4042
dc.identifier.contextkey 6160625
dc.identifier.doi https://doi.org/10.31274/rtd-180813-16518
dc.identifier.s3bucket isulib-bepress-aws-west
dc.identifier.submissionpath rtd/3043
dc.identifier.uri https://dr.lib.iastate.edu/handle/20.500.12876/74664
dc.language.iso en
dc.source.bitstream archive/lib.dr.iastate.edu/rtd/3043/r_3229146.pdf|||Fri Jan 14 23:28:50 UTC 2022
dc.subject.disciplines Mechanical Engineering
dc.subject.disciplines Operations Research, Systems Engineering and Industrial Engineering
dc.subject.keywords Industrial and manufacturing systems engineering
dc.subject.keywords Industrial engineering
dc.subject.keywords Mechanical Engineering
dc.title Yield improvement of chemical mechanical planarization processes
dc.type dissertation
dc.type.genre dissertation
dspace.entity.type Publication
relation.isOrgUnitOfPublication 51d8b1a0-5b93-4ee8-990a-a0e04d3501b1
thesis.degree.level dissertation
thesis.degree.name Doctor of Philosophy
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