Analysis of heat stress associated with wearing chemical protective clothing using a numerical model

Date
2017-01-01
Authors
Yang, Jie
Wang, Liwen
Song, Guowen
Li, Rui
Xiang, Chunhui
Song, Guowen
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Abstract

A numerical model was applied to evaluate heat stress under different thermal environmental conditions, activity intensities, and the effect of movement status on clothing properties when wearing a typical CPC. It was concluded that the ambient temperature and metabolic rate is strongly associated with heat stress and reduced the tolerance time. Although the manikin movement greatly affected the thermal insulation and evaporative resistance of CPC, the effects of movement on heat stress can be neglected.

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