Ultrasonic Measurement of Interfacial Properties in Completed Adhesive Bonds

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1979
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Alers, George
Eksley, R
Richardson, John
Fertig, K
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Review of Progress in Quantitative Nondestructive Evaluation
Center for Nondestructive Evaluation

Begun in 1973, the Review of Progress in Quantitative Nondestructive Evaluation (QNDE) is the premier international NDE meeting designed to provide an interface between research and early engineering through the presentation of current ideas and results focused on facilitating a rapid transfer to engineering development.

This site provides free, public access to papers presented at the annual QNDE conference between 1983 and 1999, and abstracts for papers presented at the conference since 2001.

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The problem of detecting weak adhesion in completed adhesive bonds can be considered a problem in measuring the effective acoustic impedance of a thin layer at the adherend to adhesive interface. By calculating the ultrasonic reflection coefficient of the entire sandwich structure as a function of frequency including an interfacial layer, it can be shown that quite obvious changes in the reflection spectrum can be produced by minor changes in the properties of the thin layer. The inverse problem of deducing the properties of the thin layer from experimental measurements is more difficult because of the sensitivity of the results to small experimental errors in the data. However, special procedures based on estimation theory are being.developed for use on actual ultrasonic data obtained from specimens with both optimum and degraded adhesive bonds. Once the elastic properties of the interfacial layer have been deduced from ultrasonic or other nondestructive measurements, they can be used to infer the physical state of the material at the interface. Models that relate the physical state of polymers to their failure probability such as that being developed by D. H. Kaelble can then be used to predict the strength and reliability of the adhesive bond.

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