Planning Activity Report for NDE of Adhesive Bonded Structures
Following a workshop held at the Rockwell International Science Center, Thousand Oaks, California in January, 1979, an ad hoc planning activity was undertaken to set forth a program plan to address the needs in NDE for adhesive bonded structures. The objectives of the planning activity were to develop a program rationale and strategy, determine the existence of reasonable approaches, and to propose a detailed plan of action for review at the annual DARPA/AF meeting in September, 1979. The plan encompasses the basic elements of an accept/reject methodology based on fracture mechanics, expected developments of valid flaw growth models, stress analysis, and non-destructive measurement techniques. A central issue is the prospect for determining a valid non-destructive measure of strength for the bonded joint as might be reflected in the tendency for preexistent flaws to propagate under environmental loads.