Implementing Native Support for Oculus and Leap Motion in a Commercial Engineering Visualization and Analysis Platform

Date
2016-02-14
Authors
MacAllister, Anastacia
Winer, Eliot
MacAllister, Anastacia
Major Professor
Advisor
Committee Member
Journal Title
Journal ISSN
Volume Title
Publisher
Altmetrics
Authors
Research Projects
Organizational Units
Mechanical Engineering
Organizational Unit
Journal Issue
Series
Department
Mechanical EngineeringElectrical and Computer Engineering
Abstract

While previous research in academia points to the ability of Natural User Interfaces (NUIs) and low-cost display devices to help users better understand a design, there does not exist much research on how these devices can be integrated into existing legacy code used by engineering and design firms. The lack of commercial engineering software that integrates NUIs and low-cost display devices, like the Oculus Rift, can be attributed to the fast changing device market and the lack of awareness many engineering software makers show in emerging interaction paradigms. The lack of work in the area of integrating low-cost immersion devices into commercial software creates a barrier for adoption of these new devices and interaction paradigms. The work presented in this paper details a proof of concept system integrating the Leap Motion and Oculus Rift, into a commercial engineering visualization and analysis package called Siemens’ Teamcenter® Lifecycle Visualization Mockup (Mockup). Based on the recorded performance data, hooking up both the Leap and the Oculus results in a frame rate of around 30 frame per second. Indicating that these two devices together can provide real time, fluid interaction in a commercial engineering platform.

Comments

This article is published as MacAllister, Anastacia, Tsung-Pin Yeh, and Eliot Winer. "Implementing Native Support for Oculus and Leap Motion in a Commercial Engineering Visualization and Analysis Platform." Electronic Imaging 2016, no. 4 (2016): 1-11. DOI: 10.2352/ISSN.2470-1173.2016.4.ERVR-417. Posted with permission.

Description
Keywords
Citation
DOI
Collections