In this paper, we present the results of a study[1] motivated by the radiographic inspection of solder joints on double-sided printed circuits. Our goal was to obtain quantitative information about the structures in these planar objects, taking into account the acquisition geometry and time constraints. On one hand, we must limit the acquisition angle for projections at a value of ± 50 degrees with respect to the normal to the object plane, in order to limit the attenuation of the material crossed by X-rays. On the other hand, we must limit the number of projections in order to reduce as far as possible the acquisition and processing times.