The goal of this work is to examine attenuation effects so that suitable procedures, signal processing techniques, etc., can be used in considering attenuation influences in the adhesive bonding inspection problem. I might point out that we've performed some work under sponsorship of AFOSR, and to date have been reasonably successful in performing ultrasonic inspection of aluminum FM-47 aluminum-type bonds. We' ve also developed some of the physical modelling and computer programming tools that were used in the work being presented. The work associated with the attenuation is sponsored by Roc well under the ARPA/AFML program.