Atomic Reconstruction of Au Thin Films through Interfacial Strains
Date
2024-01-30
Authors
Martin, Andrew
Chen, Jiahao
Du, Chuanshen
Kumar, Manish
Tevis, Ian D.
Chang, Boyce
Thuo, Martin M.
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American Chemical Society
Abstract
Interfaces play a critical thermodynamic role in the existence of multilayer systems. Due to its utility in bridging energetic and compositional differences between distinct species, the formation of interfaces inherently creates internal strain towards bulk atoms due to the reorganization needed to accommodate such interface. We report the effect of scaling interfacial stress due to deposition of different adlayers on a host thin metal film. Intrinsic property differences between host and de-posited metal atoms result in varying degree of composition and energy gradient within the interface. Interfacial stress can increase defects in the host leading to; i) energy dissipation and reorganization to minimize surface energy, ii) increased material strength. We infer that dissipation of interfacial stress induces defect migration, hence bulk and surface atomic reconstruction as captured by the surface roughness and grain size reduction coupled with concomitant increase in material strength.
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article
Comments
This is a manuscript of the article published as Martin, Andrew, Jiahao Chen, Chuanshen Du, Manish Kumar, Ian D. Tevis, Boyce Chang, Sid Pathak, and Martin M. Thuo. "Atomic Reconstruction of Au Thin Films through Interfacial Strains." Nano Letters 24, no. 6 (2024): 1967-1973. doi: https://doi.org/10.1021/acs.nanolett.3c04412.