Adhesively bonded components and structures are widely used in many critical aerospace applications. Several techniques have been developed to evaluate the integrity of adhesive bonds nondestructively. Most of the techniques rely on the ability to correlate the bond integrity to the behavior of the bondline region to elastic wave propagation. Testing for the relative rigidity between the adherend and adhesive layer at the bond interface will yield reliable information of the bond integrity. This can be achieved by either applying stress in the bondline region externally, or be induced internally.