Evaluating the Integrity of Adhesive Bonds by the Measurement of Acoustic Properties under Stresses

Thumbnail Image
Date
1993
Authors
Jagasivamani, V.
Smith, Alphonso
Major Professor
Advisor
Committee Member
Journal Title
Journal ISSN
Volume Title
Publisher
Authors
Research Projects
Organizational Units
Journal Issue
Is Version Of
Versions
Series
Series
Review of Progress in Quantitative Nondestructive Evaluation
Center for Nondestructive Evaluation

Begun in 1973, the Review of Progress in Quantitative Nondestructive Evaluation (QNDE) is the premier international NDE meeting designed to provide an interface between research and early engineering through the presentation of current ideas and results focused on facilitating a rapid transfer to engineering development.

This site provides free, public access to papers presented at the annual QNDE conference between 1983 and 1999, and abstracts for papers presented at the conference since 2001.

Department
Abstract

Adhesively bonded components and structures are widely used in many critical aerospace applications. Several techniques have been developed to evaluate the integrity of adhesive bonds nondestructively. Most of the techniques rely on the ability to correlate the bond integrity to the behavior of the bondline region to elastic wave propagation. Testing for the relative rigidity between the adherend and adhesive layer at the bond interface will yield reliable information of the bond integrity. This can be achieved by either applying stress in the bondline region externally, or be induced internally.

Comments
Description
Keywords
Citation
DOI
Copyright
Fri Jan 01 00:00:00 UTC 1993