In situ assembly enabling adhesive-free bonding of large area electronic sensors to concrete for structural health monitoring
Date
2024-10-01
Authors
Ogunniyi, Emmanuel
Liu, Han
Downey, Austin RJ
Li, Jian
Bennett, Caroline
Collins, William
Jo, Hongki
Ziehl, Paul
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IOP Publishing Ltd
Abstract
Cracks developed in concrete infrastructure are one of the primary mechanisms that degrade their structural integrity, which may result in structural failures. Previous research on soft elastomeric capacitors (SEC) has shown their viability for structural health monitoring of structural materials, including concrete, steel, and fiberglass composites. The SEC, or its derivative version with a corrugated geometry termed corrugated SEC or cSEC, is a parallel plate capacitor. Prior work demonstrated that it was possible to directly paint the electrode interfacing with the structural material onto the structure and adhere the rest of the pre-fabricated sensor onto the wet interface, thereby eliminating the need for a joining epoxy. This demonstration was conducted on steel and fiberglass. The study on concrete was left to future work as concrete exhibits a much rougher surface and structure/sensor capacitive coupling, causing a significant amplification in signal noise. This study advances structural health monitoring in concrete applications by investigating the in situ assembly of the SEC on concrete where the carbon black (CB)-based electrode plate of the cSEC is directly painted onto the concrete surface and serves as both the adhesive and electrode for the sensor. A series of free-vibration and compression tests were designed and conducted to evaluate the sensing performance of in situ assembled cSEC compared to that of an epoxy-bonded cSEC. Additionally, the bonding strength of the in situ assembled and epoxy-bonded cSEC is evaluated through a peel test. Results show good strain sensing capabilities of the in situ assembled SEC with an R2 value of 0.986 and a resolution of 45. Even though the epoxied cSEC demonstrated a higher bonding strength than the in situ assembled cSEC, the in situ assembled cSEC demonstrated adequate bonding strength for the application. This research contributes to the scientific understanding of sensor adhesion and opens avenues for practical applications in infrastructure monitoring, potentially leading to more resilient and sustainable urban environments.
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Comments
This article is published as Ogunniyi, Emmanuel, Han Liu, Austin Downey, Simon Laflamme, Jian Li, Caroline R. Bennett, William Collins, Hongki Jo, and Paul Ziehl. "In situ assembly enabling adhesive-free bonding of large area electronic sensors to concrete for structural health monitoring." Smart Materials and Structures (2024). doi: https://doi.org/10.1088/1361-665X/ad7d56.
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© 2024 The Author(s). This article is licensed as (https://creativecommons.org/licenses/by/4.0/).