Analysis of Scanning Acoustic Microscopy Images of IC Chips

dc.contributor.author Khan, J.
dc.contributor.author Mina, Mani
dc.contributor.author Udpa, L.
dc.contributor.author Udpa, S.
dc.date 2018-02-14T05:07:21.000
dc.date.accessioned 2020-06-30T06:42:09Z
dc.date.available 2020-06-30T06:42:09Z
dc.date.copyright Sun Jan 01 00:00:00 UTC 1995
dc.date.issued 1995
dc.description.abstract <p>The detection, isolation, and characterization of flaws in components represent a critical need in manufacturing and quality control. Nondestructive testing (NDT) provides an effective way of inspecting materials for ensuring the quality and integrity of products and systems. Consequently, nondestructive inspection finds extensive application in several industries such as steel, nuclear and electronic industries for the evaluation of complex test objects with minimal interruption of routine operations[1].</p>
dc.format.mimetype application/pdf
dc.identifier archive/lib.dr.iastate.edu/qnde/1995/allcontent/115/
dc.identifier.articleid 2137
dc.identifier.contextkey 5789468
dc.identifier.s3bucket isulib-bepress-aws-west
dc.identifier.submissionpath qnde/1995/allcontent/115
dc.identifier.uri https://dr.lib.iastate.edu/handle/20.500.12876/60366
dc.language.iso en
dc.relation.ispartofseries Review of Progress in Quantitative Nondestructive Evaluation
dc.source.bitstream archive/lib.dr.iastate.edu/qnde/1995/allcontent/115/1995_Khan_AnalysisScanning.pdf|||Fri Jan 14 18:51:23 UTC 2022
dc.source.uri 10.1007/978-1-4615-1987-4_115
dc.subject.disciplines Signal Processing
dc.subject.keywords Electrical and Computer Engineering
dc.title Analysis of Scanning Acoustic Microscopy Images of IC Chips
dc.type event
dc.type.genre article
dspace.entity.type Publication
relation.isAuthorOfPublication 67ebca67-8fe0-45a7-ba89-f52eaef49ab1
relation.isSeriesOfPublication 289a28b5-887e-4ddb-8c51-a88d07ebc3f3
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