Ceramic tape casting is critical to the electronics industry for manufacturing a wide range of components including piezoelectric actuators, MLC capacitors, and substrates for VLSI and LSI chips [1–3]. Recent regulatory changes, led by the Environmental Protection Agency concerning hazardous chemicals used in ceramic tape-casting, have renewed interest in the development of environmentally-friendly modifications to this process. In turn, this has increased interest in developing a better, fundamental understanding of how microstructural defects form and evolve during the sequence of processing steps associated with tape casting. In order to form more reliable electronic components, there is a need to develop a better, basic understanding of how to eliminate these defects by optimizing critical processing variables.