A scratch intersection model of material removal during Chemical Mechanical Planarization (CMP)

dc.contributor.author Che, Wei
dc.contributor.author Guo, Yongjin
dc.contributor.author Chandra, Abhijit
dc.contributor.author Bastawros, Ashraf
dc.contributor.author Bastawros, Ashraf
dc.contributor.department Aerospace Engineering
dc.contributor.department Mechanical Engineering
dc.date 2018-02-17T14:24:49.000
dc.date.accessioned 2020-06-29T22:46:09Z
dc.date.available 2020-06-29T22:46:09Z
dc.date.copyright Sat Jan 01 00:00:00 UTC 2005
dc.date.issued 2005-08-01
dc.description.abstract <p>A scratch intersection based material removal mechanism for CMP processes is proposed in this paper. The experimentally observed deformation pattern by SEM and the trends of the measured force profiles (Che et al., 2003) reveal that, for an isolated shallow scratch, the material is mainly plowed side-way along the track of the abrasive particle with no net material removal. However, it is observed that material is detached close to the intersection zone of two scratches. Motivated by this observation, it is speculated that the deformation mechanism changes from ploughing mode to shear-segmentation mode as the abrasive particle approaches the intersection of two scratches under small indentation depth for ductile metals. The proposed mechanistic material removal rate (MRR) model yields Preston constant similar to those observed experimentally for CMP processes. The proposed model also reveals that the nature of the slurry-pad interaction mechanism, and its associated force partitioning mechanism, is important for determining the variation of MRR with particle size and concentration. It is observed that under relatively soft pads, small particles and low particle concentration, the pad undergoes local deformation, yielding an increased MRR with increasing particle size and concentration. At the other extreme, the intact walls of the surface cells and the connecting cell walls between the surface pores deform globally, resembling a beam or a plate, and a decreasing trend in MRR is observed with increasing particle size and concentration. The predicted MRR trends are compared to existing experimental observations.</p>
dc.description.comments <p>This article is from <em>Journal of Manufacturing Science and Engineering</em> 127 (2005): 545, doi: <a href="http://dx.doi.org/10.1115/1.1949616" target="_blank">10.1115/1.1949616</a>. Posted with permission.</p>
dc.format.mimetype application/pdf
dc.identifier archive/lib.dr.iastate.edu/aere_pubs/66/
dc.identifier.articleid 1064
dc.identifier.contextkey 8296441
dc.identifier.s3bucket isulib-bepress-aws-west
dc.identifier.submissionpath aere_pubs/66
dc.identifier.uri https://dr.lib.iastate.edu/handle/20.500.12876/2068
dc.language.iso en
dc.source.bitstream archive/lib.dr.iastate.edu/aere_pubs/66/2005_BastawrosAF_ScratchIntersectionModel.pdf|||Sat Jan 15 01:25:22 UTC 2022
dc.source.uri 10.1115/1.1949616
dc.subject.disciplines Aerospace Engineering
dc.subject.disciplines Mechanical Engineering
dc.subject.keywords Chemical mechanical planarization (CMP)
dc.subject.keywords Ductile metals
dc.subject.keywords Isolate shallow scratch
dc.subject.keywords Material removal rate (MRR)
dc.subject.keywords force measurement
dc.subject.keywords particle size analysis
dc.subject.keywords scanning electron microscopy
dc.title A scratch intersection model of material removal during Chemical Mechanical Planarization (CMP)
dc.type article
dc.type.genre article
dspace.entity.type Publication
relation.isAuthorOfPublication 5dc5d008-4c85-41c9-b47c-7c55b44ca802
relation.isOrgUnitOfPublication 047b23ca-7bd7-4194-b084-c4181d33d95d
relation.isOrgUnitOfPublication 6d38ab0f-8cc2-4ad3-90b1-67a60c5a6f59
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