Correlation of Thin-Film Bond Compliance and Bond Fracture Resistance

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1988
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Addison, R.
Marshall, D.
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Review of Progress in Quantitative Nondestructive Evaluation
Center for Nondestructive Evaluation

Begun in 1973, the Review of Progress in Quantitative Nondestructive Evaluation (QNDE) is the premier international NDE meeting designed to provide an interface between research and early engineering through the presentation of current ideas and results focused on facilitating a rapid transfer to engineering development.

This site provides free, public access to papers presented at the annual QNDE conference between 1983 and 1999, and abstracts for papers presented at the conference since 2001.

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The integrity of the interfacial bond between a coating and its substrate is of primary importance for any application. A technique for the quantitative nondestructive measurement of the bond fracture energy is essential for evaluating bond integrity. Scanning acoustic microscopy (SAM) provides a method for making localized measurements of film dis-bonds and film bond compliance based on the changes in the surface acoustic wave velocity in the layered medium. The results of these measurements for chrome/gold and gold films on glass substrates are summarized. The compliance of the bond and its fracture energy can be correlated in some film systems. An experiment to determine if this correlation exists for chrome/gold and gold films on sapphire substrates is described. Results of such an experiment would provide an empirical correlation between surface acoustic wave velocity measurements and the fracture energy of the film. The results of an experiment to measure the fracture energy of the interfacial bond between a gold film and the sapphire substrate are described.

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Fri Jan 01 00:00:00 UTC 1988